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Brown Oxidizing Process Chemicals--HBO-100 series
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Process flow

brown oxidizing HBO-100
Brown oxidizing HBO-100 product is special formulated for inner-layer copper oxide replacement process of meeting higher peel strength, excellent multiple pressing resistance as market demands by Jiangnan Fine Chemical. HBO-100 may replace conventional black oxide process and is suitable for both vertical and horizontal operation. HBO-100 process can produce proper surface morphology on inner-layer copper (see picture 1).This special topography provides effective adhesive interface which extremely strengthens inner-layer adhesion and consequently eliminates delamination failure. This process also produces even and uniform brown coating (see Picture 2) which may be applied for laser direct drilling (LDD) application. HBO-100 process is compatible with most of existing CCL (Copper-Clad Laminate) and Prepreg. It has very high reliability for most of materials, normal Tg material peel strength is over 4.0 lb/inch and high Tg materials peel strength is over 3.0 lb/inch.

process features
• Suitable for both horizontal and vertical process
• Eliminate pink ring problem
• High copper capacity (25g/L ), stable and long bath life
• Simply copper etch rate controlling by optimizing hydrogen peroxide, temperature and dwell time
• Fully compatible with existing equipments Better adhesion can be up to 4.0lb/inch
• Long holding time after finishing brown oxide
• Simple waste water treatment, less environmental problems
• Easy maintenance, operation and low running cost

Reliability testing
peel strength :>4.0lb/inch
Ionic Contamination < 6.0 μg NaCl/inch2
Thermal stress : >5 times@280℃,10sec solder dipping
IR reflow Testing:>7 times (Lead-free temperature profile)
Pink Ring : No
microetch rate control

peel strength

 
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