PF-600 is special OSP products. Through this process can form uniform organic protective film in PCB surface so as to improve anti-oxidation of cooper surface and provide good solderability. Its shelf life can be 12 months at 20-30 ℃, 40-70% R.H and vacuum package.
This process is suitable for The copper and selective ENIG surface treatment,and effectively eliminate gold pollution. Meanwhile,according to customer's demands ,we can add microetch additives(QH-2208) in PF-600 pre-treatment, which can eliminate Garvan effect and OSP potential discoloration and disconnection. PF-600 can resistant to 5 times IR reflow Testing, good solder radiation and high SMT reliability
Process features
• Suitable for horizontal operation
• The unique microetch additives can eliminate Garvan effect
• High capacity and stability, long bath life of bath
• Compatible with current equipments
• Easy wasting treatment and reduce environment problems
• Operation and low running cost
Features of OSP
• Excellent BGA solderability
• comply with RoHS and WEEE standards
• Suitable for Lead-free welding
• good solderability and 5 times IR reflow Testing
• no gold pollution and easy to control the thickness of film
• Suitable for SMT and wave-soldering and no clean process
• Convenient to redo processing
