ENIG
ENIG process is to deposit nickel-phosphorus alloys on copper surface fristly through chemical reactions, and then plate pure gold layer through displacement reaction. It is mainly used for final surface treatment of the PCB to prevent surface oxide or corrosion before assembling.
INA-800
ENIG process contains
Electroless nickel INA-810 and
Immersion gold INA-820. NIG INA-810 process is a stable, fast, bright and self pH adjusting electroless nickel product. ENIG INA-810 and INA-820 can produce very well nickel and gold plating layer, which has compact immersion gold layer, firmly adhesion with base copper and excellent solderability. Electroless nickel INA-810 plating rate is stable and fast, the deposition rate can be well control in15 ~ 20 μm/h. phosphorus content is 6-10%.
INA-810 process provides the following five chemicals:
Making-up: I
INA-810A、INA-810B、INA-810C
Replenishment:
INA-810R1、INA-810R2
Immersion gold additives:
INA-820
Process characteristics
• High stability and long bath life
• Easily active nickel working bath.
• Fast nickel deposition rate.
• Stable nickel deposition.
• High hardness and good wear resistance.
• Bright nickel-plated surface.
• Self adjusting pH system
• High impurity tolerance of Immersion gold working bath.
• Uniform and bright gold appearance throughout the entire operation MTO of Immersion gold bath
• High nickel ion contamination resistance in Immersion gold bath (0.5-1.0 g/L).
• High deposition rate and high gold purity within operation window.
• Good thermal resistance, high adhesion and excellent solderability
• Low cost ownership
Process characteristics and reliability test
ENIG INA-800 process can maintain stable deposition rate and phosphorus content throughout the entire operation MTO (Metal Turn Over). It has excellent solder joint strength.
